Promex today said it has promoted VP of Engineering David Fromm to chief operating officer.
The Santa Clara, California-based subsystems supplier hired Fromm in March. Promex said Fromm will also remain VP of engineering and lead the operations, engineering, and business development teams.
“Dave has walked in the shoes of OEM engineers, project leads, and procurement decision-makers. He is uniquely qualified to bring a customer-focused perspective to every aspect of the Promex business,” Promex CEO Richard Otte said in a news release. “He understands how to partner for turnkey, vertically integrated approaches to creating the smallest, most complex medical devices that are enabled with microelectronics.”
Before joining Promex, Fromm worked with the company as a customer for nearly 10 years. He was previously director of instrument research at Cepheid, where he led hardware and technology R&D for next-generation platforms. He collaborated with Promex on the development and construction of subassemblies for a point-of-care molecular diagnostics device.
“I needed a partner capable of iterating and building out the vision, from a blank piece of paper through design maturity, for very complex projects,” Fromm said in the news release. “My leadership at Promex is shaped by what appealed to me as a customer – the company’s capabilities, flexibility, and problem-solving skills. Promex can take early, abstract requirements and scale them into successful production and commercialization.”
Fromm holds a PhD in physical chemistry from Stanford University and a B.A. in biochemistry from the University of Colorado-Boulder. He also has patents for molecular diagnostics systems and high-speed atomic force microscopy.
Fromm will oversee technical developments for high-quality, scalable assembly and manufacturing of complex medical devices that incorporate microelectronics, Promex said. Promex offers microelectronic component assembly, process design and packaging for medtech and biotechnology firms.
Promex’s capabilities and operations include two full surface-mount technology (SMT) lines, post-wafer processing technologies (including wafer dicing, grinding, die attach, and flip-chip), wire bonding and encapsulation. Promex works with original equipment manufacturers on design and prototypes, R&D development and high-volume production.